The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
![The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages](http://hive.dmmserver.com/media/356/97814615/9781461550112.jpg)
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Barcode: 09781461550112
Brand: Springer US
There are no offers for this product at this time.