RELIFE RL-400/404S/406/SP-X 183℃/138/227 Medium/Low Temperature Tin Paste For Motherboard BGA Chips Soldering Reballing Material
![RELIFE RL-400/404S/406/SP-X 183℃/138/227 Medium/Low Temperature Tin Paste For Motherboard BGA Chips Soldering Reballing Material](https://images2.productserve.com/?w=200&h=200&bg=white&trim=5&t=letterbox&url=ssl%3Aimages.nexusapp.co%2Fassets%2Fe1%2Fa4%2Fad%2F514577978.jpg&feedId=58489&k=2991d66b7651a73400283656debdc5669c751ac3)
RELIFE RL-400/404S/406/SP-X 183℃/138/227 Medium/Low Temperature Tin Paste For Motherboard BGA Chips Soldering Reballing Material
Barcode: 08799120133270
Brand: ProductsPro
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