High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101
![High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101](https://images2.productserve.com/?w=200&h=200&bg=white&trim=5&t=letterbox&url=ssl%3Aimages.nexusapp.co%2Fassets%2F84%2F32%2Fb4%2F148823231.jpg&feedId=52929&k=49d2572c2d47cfd6cfb644f66d742158d73b063f)
High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101
Barcode: 08720422815335
Brand: ProductsPro
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