High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101

High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101

High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361 hi1101

Barcode: 08720422815335
Brand: ProductsPro
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